Nano Ag-Cu solder paste is used as an thermal interface material that effectively transfers heat generated inside semiconductors or LED devices to outside.Solder paste that treated by our unique Nano-composite metal technology can effectively transfer the heat between the thermally conductive filler and provide good connection strength and conductivity, thereby provides excellent comprehensive performance. In addition, our product that applied Ag-Cu as the filler can greatly reduce the cost compared with other products used silver powder. And it is possible to control various properties according to customer’s requirement.